Flash etching agent for M-SAP

Flash etching agent for M-SAP

This is optimum for the removal (flash etching) of seed layers in a modified semi-additive process (M-SAP).It can greatly inhibit the occurrence of side etching (undercutting) compared to chemicals of normal H₂O₂/H₂SO₄ compositions.

• It can inhibit undercutting.
• It can inhibit variation of in-plane etching thickness.
• The concentration of the main ingredients H₂O₂/H₂SO₄ enables automatic analysis with liquid management device in addition to manual analysis, and is effective in saving energy.