Products
Materials for printed wiring boards using BT resin
High-function “materials for printed wiring boards using BT resin” with high heat resistance and low thermal expansion characteristics attracting attention as a next-generation material used in semiconductor packaging applications and chip LED boards and cutting-edge fields such as 5G
materials for printed wiring boards using BT resin are manufactured using BT resins (Bismaleimide Triazine resins) developed with the original technology of MGC.They have superior characteristics such as high heat resistance and low thermal expansion, and have seized a large market share in semiconductor packaging applications, chip LED applications, and high-frequency applications, etc.Development of new applications as a next-generation material suitable for high-speed/low signal loss transmission in 5G high-frequency domains is also expected.
- Superior heat resistance (glass transition temperature 200-300°C)
- Superior long-term heat resistance (long-term temperature resistance temperature 160-230°C)
- Low thermal expansion characteristics
- Superior dielectric characteristics (low permittivity, low dielectric tangent)
- Superior electrical insulation characteristics
Main Applications
- Semiconductor packaging applications
Used as semiconductor board materials loaded onto application processors and memories (memory areas) that are the brains of tablet PCs and smartphones, and boards of camera components. - Chip LED board applications
Used as board materials for chip LEDs.Because of their resistance to color change and high reflectivity of LED light, they are also used in key button lighting, camera flashes, and LCD backlights, etc. - High-frequency circuit applications
With their superior dielectric characteristics and high heat resistance characteristics, they are also adopted in the quasi-microwave domain. - Chip on board, burn-in board, and multi-layer printed wiring board applications
Because of their stable mechanical characteristics (bending characteristics, silver foil adhesion, Barcol hardness, etc.), and good component mountability, they are also used in chip on board, burn-in board, and multi-layer printed wiring board applications.