Products
Clean Etch WLC-T, WLC-C2 (Solutions for Wafer-level chip size packaging)
Wafer-level chip size packaging application etching of specific metals wherein multiple metals coexist Clean Etch WLC-T, WLC-C2
The WLC series is a chemical for wafer bump forming applications for wafer-level chip size packaging.
WLC-C2
- This is able to selectively etch Cu without corrosion on metals such as Sn alloys (solder), Ti, or Al.
- It is suitable for the flash etching of locations formed with sputter copper on seed layer and electroplated copper in wiring.
- Chemical fluid management is easy with superior fluid stability.
WLC-T
- This is able to selectively etch Ti and Ti alloys without corrosion on metals such as Cu, Al, or Sn alloys (solder).
- Because of the good fluid stability when metals have been dissolved, the amount used is greatly inhibited compared to conventional hydrogen peroxide/ammonia solutions.
- It is able to extend the lifetime of the liquid through fluid management, and is able to reduce running costs.