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SOLBLE（Fluoro Liquid）

List of typical physical characteristics
Main Applications

Colorless, transparent, high-performance fluorinated fluids

SOLBLE（Fluoro Liquid）

The SOLBLE series is a high-performance fluorine-based fluid with properties and structure equivalent to products such as Novec and Fluorinert, and is used for precision cleaning, dilution solvents, heat transfer media for semiconductor equipment, and media for reliability testing.

  • Excellent thermal stability：Resists decomposition even at high temperatures, allowing stable performance to be maintained.
  • Non-flammable：Has no flash point and is highly safe.
  • Low viscosity/low surface tension：Penetrates easily into small gaps, making it suitable for precision cleaning.
  • Electrical insulation：Does not conduct electricity easily, making it usable for cooling and cleaning electronic components.
  • Chemical stability/inert：Does not react with most substances, and does not cause corrosion or deterioration of materials.
  • Transparent/odorless：Transparent and almost odorless, it can be used in clean environments.

List of typical physical characteristics (SOLBLE series)

*The data is for 25℃, but it is not a standard value and may differ from the actual value.

HFE (hydrofluoroether)

item unit RE1000 RN2000 RE2200 RN3000
chemicals   HFE HFE HFE HFE
boiling point ℃ 59 76 75 98
Pour point ℃ -135 -138 -150 -38
vapor pressure kPa 28.00 14.53 18.40 5.50
Latent heat of vaporization (boiling point) kJ/kg 112 126 119 102
density g/cm3 1.50 1.43 1.43 1.66
kinematic viscosity cst 0.38 0.40 0.46 0.73
Absolute viscosity cP 0.60 0.57 0.66 1.21
specific heat J/kgk 1183 1214 1215 1093
thermal conductivity W/mK 0.069 0.069 0.068 0.063
surface tension mN/m 13.6 13.6 13.6 14.0
Expansion coefficient m3K/m3 0.0017 0.0016 0.0016 0.0013
refractive index   1.28 1.28 1.28 1.28
Dielectric strength kV >25 23 >25 >25
Volume resistance (DC500V) Ωm 1.0×106 1.0×108 1.0×106 1.0×106
Dielectric constant (1kHz)   7.3 7.4 7.5 6.3
Water solubility ppm 95 92 92 67
Water solubility ppm 12 <5 <5 <0.3
flash point ℃ none none none none
Flammable range Vol% none none none none
GWP   272 57 48 310

PFC (perfluorocarbon), PFPE (perfluoropolyether)

item unit RT1300 RE1350 RE1700 RH2000
chemicals   PFC PFPE PFPE PFPE
boiling point ℃ 128 132 170 200
Pour point ℃ -65 -100 -100 -85
vapor pressure kPa 1.44 0.75 0.11 -
Latent heat of vaporization (boiling point) kJ/kg 78 85 76 -
density g/cm3 1.82 1.73 1.77 1.79
kinematic viscosity cst 0.81 0.94 2.10 2.90
Absolute viscosity cP 1.40 1.63 3.72 -
specific heat J/kgk 1100 969 972 960
thermal conductivity W/mK 0.067 0.065 0.065 0.065
surface tension mN/m 14.6 13.5 14.0 19.0
Expansion coefficient m3K/m3 0.0014 0.0012 0.0011 0.0011
refractive index   1.28 1.28 1.28 1.28
Dielectric strength kV >40 >40 >40 40
Volume resistance (DC500V) Ωm 1.0×1014 1.0×1011 1.0×1011 >1.0×1015
Dielectric constant (1kHz)   1.9 1.9 1.9 <2.0
Water solubility ppm 7 <50 <50 <10
Water solubility ppm <5 <14 <14 -
flash point ℃ none none none none
Flammable range Vol% none none none none
GWP   >8000 7800 7800 7800

Main Applications

1. Coolants and Heat Transfer Media -
  • Immersion Cooling：Data center servers, high-performance computer CPUs, power semiconductors, etc. are cooled by directly immersing them in liquid.
  • Semiconductor Manufacturing Equipment：Used as a circulating chiller fluid to precisely control the temperature of dry etching equipment, exposure equipment, ion implantation equipment, etc.
2. Cleaning -
  • Precision Cleaning：Used to clean precision parts such as semiconductor wafers, integrated circuits, optical lenses, and camera modules, and to rinse them after drying.
  • Degreasing Cleaning：Used to remove oil and wax from machine parts after processing.
3. Solvents and Diluents
  • Fluorine-Based Coating Solvents：Used as a diluting solvent for water-repellent, oil-repellent, and anti-fouling coatings.
  • Fluorine-Based Oil and Grease Dilution：Used to adjust the viscosity of lubricants.
  • Dissolving and dispersing fluororesin polymers
4. Testing and Inspection
  • Leak Test (Airtightness Test)：Used as an immersion liquid to test the airtightness of electronic components.
  • Thermal Shock Test：Used as a high- and low-temperature immersion liquid to evaluate durability against sudden temperature changes.
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