Products
Cushion Materials for hot pressing
A groundbreaking cushion material with superior cushioning performance and restorability, achieving high board thickness precision and superior uniformity
Cushion materials for hot pressing are used in press-forming of electronic substrates such as copper-clad laminates and printed wiring boards, greatly increasing the productivity of hot pressing processes.A unitary cushion material in which multiple heat-resistant materials such as surface materials, rubber, and shock-absorbing materials are combined achieves high board thickness precision with superior cushioning performance and restorability.In addition, the superior durability enables hundreds of successive uses, and also contributes to cost reductions.It is also applicable to the press forming of products that require relaxation of press microstrain.
- Heat resistance (continuous use possible at 230°C)
- Cushioning performance (superior cushioning performance compared to paper cushioning material)
- Durability (Several hundred times of successive uses are possible)
Main Applications
- Used in the press forming of electronic substrates such as copper-clad laminates and printed wiring boards.
- Also used during the press forming of products that require the relaxation of press microstrain.